Hardware Club

[MonkY]

Darkie, ai dreptate! Cam asa a fost mai mereu la AMD. Au avut super procesoare de-a lungul timpului, pe care le-au omorat cu suportul tehnic si cu chipset-urile pt. placile de baza aferente. Eu cred ca v-am mai povestit cum am renuntat eu (intr-un final la AMD).... daca as transpune povestea in ziua de azi ar fi asa: Vand Intel-ul meu si merg si cumpar un 1800X, cumpar cea mai scumpa/buna placa de baza (cu chipset AMD), memorii optimizate pt. Ryzen and so on. Apar primele probleme (crashuri, BSOD-uri mostly). Ma rog la update-uri de BIOS, la drivere mai bune. Si trece o luna, in care incerc alte placi de baza, schimbi X piese din configuratie (de exp. la mine nu se pupa cu Audigy-ul sau nu stiu ce Creative aveam atunci) and so on. Si dupa o luna de incercari, intru la AMD pe site si vad "this chipset support has been discontinued". Vand totul la jumatate de pret (pt. ca deja toti stiu de problema). Cum sa nu ma oftic?

Mi se intampla sa mai lucrez pe la cate un client cu AMD (din ce in ce mai rar lately, mai ales cand vine vorba de notebook-uri)... si caut si eu ca tot omul drivere. In afara de partea de GPU-uri (si aici o sa va povestesc inca una tare mai jos) unde stau cat de cat bine, ramai socat sa vezi ca pt. un chip lansat in 2008, driverul e din 2008 - hai 2009. Si aleluia! Asa ceva nu exista la Intel.

Referitor la GPU... a fost o faza super tare: luasem nu stiu ce nebunie de la ei (chiar nu mai imi aduc acum aminte ce model), dar era ceva ce se spunea ca rupe gura targului. Am pus-o frumos... mare bug: cursorul de la mouse, in orice joc sau in Windows, se facea de 100x mai mare (3 sferturi din ecran). Initial era de ras... dar mi-am dat seama ca e de plans. Si faza si mai tare a fost cand am intrat la AMD pe pagina de drivere, si scria acolo ca pt. orice problema sa lasam un mesaj, ca meseriasul care lucreaza la driverele pt. placa respectiva este momentan in concediu in Hawaii or something. Deci a fost... WOW!

Sunt constient ca intre timp si-au mai rezolvat din issues... dar nah. Au multe de demonstrat. Sper ca Ryzen sa fie un inceput bun! Atat de bun incat la anul sa nici nu ma mai uit la Intel!

[rodarkone]

In momentul de fata vis-a-vis de performanta oferita la pretul oferit, daca as avea nevoie de PC nou, eu as lua amd (pentru a ii incuraja)

Din pacate, in cazul meu, nu puteam sa stau fara computer, desi am avut la mine laptopul insa mi-a crapat la el ecranul, a 5-a oara si am zis sa nu mai insist, il trec la pierderi si aia e .. viata merge inainte, asa ca am cumparat asta (vezi poza) ... probabil 1-2 ani tot ma va tine (tin minte cand am luat 4790k .. superb a fost, la 4.9 GHz, cu 2x980Ti pe apa de la evga, o experienta sublima, a trebuit sa fac cadou tot sistemul pentru ca nu l-ar mai fi cumparat nimeni (si nici nu aveam timp sa stau sa il vand) desi am incercat initial, apoi am aflat ca varul meu (prin alianta) a intrat cu o nota buna la facultate si am zis - ca merita un sistem suficient de puternic

[tudyniuz]

NVIDIA GTX 1080 Ti REVIEW

[maniacu]

Powermac G4 firewire 800 dual processor 1.42 ghz pentru colectie
Imgur: The most awesome images on the Internet

[rodarkone]

Ceva mai special




Sent from my iPhone using Tapatalk Pro

[RonanN1]

[Prototype93D]

Salutare! Am si eu o nelamurire. Vreau sa imi cumpar o placa de captura noua si nu stiu sigur daca e compatibila cu laptopul meu. Aveti mai jos cateva specificatii de la placile de captura, iar in poza specificatiile laptopului meu.

RAZER RIPSAW
Windows 10/8.1/7 (64/32 bit)
USB 3.0 powered
Desktop: Intel Core i5-4440 3.10GHz si mai nou
Laptop: Intel Core i7-4810MQ si mai nou
Desktop: NVIDIA GeForce GTX 660 si mai nou
Laptop: NVIDIA GeForce GTX870M si mai nou
Memorie: 4GB minimum (8GB recoomandat)

AVERMEDIA EXTREMECAP U3
Windows® 10 / Windows 8.1 / Windows 7 / Mac OS X 10.9 / 10.10 / 10.11
Desktop: Intel® Core™ i5-3400 + NVIDIA GT630
Laptop: Intel® Core™ i7-3537U 2.0 GHz + NVIDIA GT735
VGA card supporting DirectX 10
Sound card
4 GB RAM
Powered USB 3.0 port
Intel chipset with native USB 3.0 host controller

AVERMEDIA LIVE GAMER EXTREME
Windows® 10 / Windows 8.1 / Windows 7
Desktop: Intel® Core™ i5-4440 3.10 GHz + NVIDIA GeForce GTX 660
Laptop: Intel® Core™ i7-4810MQ + NVIDIA GeForce GTX 870M
4 GB RAM (8 GB recommended)
Powered USB 3.0 port with recommended chipset including Intel

[RonanN1]

[RonanN1]

Desi ii de cateva luni <3 recomand clipul cu drag. Eu tocmai mi-am luat un ASUS ROG CROSSHAIR VIII HERO <3 ma pregatesc pt. 3950x

[RonanN1]

The Best PC Monitors For Gaming: 2020 Edition

[paul]

[...] Today’s announcement isn’t just that our new Gate-All-Around (GAA) nanosheet device architecture enables us to fit 50 billion transistors in a space roughly the size of a fingernail. It’s not just that IBM Research’s second-generation nanosheet technology has paved a path to the 2-nanometer (nm) node. Or that we produced this breakthrough technology on a 300 millimeter (mm) wafer built at IBM Research’s semiconductor research facility in Albany, NY. [...]

This second iteration of our nanosheet transistor architecture involves a new type of horizontally stacked GAA chip design. Four “gates” on a transistor enable superior electrical signals to pass through and between other transistors on a chip. [...]

Put in perspective, 2 nm processors used in cell phones could quadruple the battery life of cell phones using 7 nm process technology, such as the iPhone 11, Samsung Galaxy S10 and Google Pixel 5. Based on average use, this means the phone would only need to be charged once every four days.

Scaling to the 2 nm chip node transistor equates to an approximate 45 percent performance improvement over today’s 7 nm chips, using the same amount of power. That’s an approximate 75 percent power savings, at the same performance level. This kind of power/performance combination is essential to accelerating the development and delivery of advanced cognitive, edge and other computing platforms delivered via hybrid cloud environments, as well as encryption accelerators built to operate with quantum computers.

IBM Research continues to explore options for continued scaling to 1 nm and beyond. [...]

Although we’re still several years away from manufacturing of 2 nm node devices, IBM Research’s innovations feed directly into our commercial product roadmap. [...]

Our 2 nm chip: the sum of several “Aha!” moments | IBM Research Blog

[paul]

Despre chip production, proces si business:

Shortages of semiconductors are battering automakers and tech giants, raising alarm bells from Washington to Brussels to Beijing. The crunch has raised a fundamental question for policymakers, customers and investors: Why can’t we just make more chips?

There is both a simple answer and a complicated one. The simple version is that making chips is incredibly difficult—and getting tougher.

“It’s not rocket science—it’s much more difficult,” goes one of the industry’s inside jokes.

The more complicated answer is that it takes years to build semiconductor fabrication facilities and billions of dollars—and even then the economics are so brutal that you can lose out if your manufacturing expertise is a fraction behind the competition. Former Intel Corp. boss Craig Barrett called his company’s microprocessors the most complicated devices ever made by man. [...]

Manufacturing a chip typically takes more than three months and involves giant factories, dust-free rooms, multi-million-dollar machines, molten tin and lasers. The end goal is to transform wafers of silicon—an element extracted from plain sand—into a network of billions of tiny switches called transistors that form the basis of the circuitry that will eventually give a phone, computer, car, washing machine or satellite crucial capabilities. [...]

So Small Yet So Complex [...]

Chip companies try to pack more transistors into chips, enhancing performance and making devices more power efficient. Intel’s first microprocessor—the 4004—was released in 1971 and contained only 2,300 transistors with a node size of 10 microns, or 10 millionths of a meter. But Intel’s undisputed leadership of the following decades ended between 2015 and 2020 when rivals Taiwan Semiconductor Manufacturing Co. and Samsung Electronics Co. started building chips with better transistors: ones with dimensions down to 5 nanometers, or 5 billionths of a meter (for comparison, an average human hair is 100,000 nanometers wide.)

Cleaner Than a Surgery

Before you put silicon into chipmaking machines, you need a clean room. A very clean room. Individual transistors are many times smaller than a virus. Just one speck of dust can cause havoc and millions of dollars of wasted effort. To mitigate this risk, chipmakers house their machines in rooms that essentially have no dust.

To maintain that environment, the air is constantly filtered and very few people are allowed in. If more than one or two workers appear on a chip production line—wrapped head-to-toe in protective equipment—that could be a sign something’s wrong. The real geniuses behind semiconductor design and development work miles away. [...]

Even with all those precautions, the wafers of silicon can’t be touched by humans or exposed to the air. They travel between machines in cartridges carried by robots that run on tracks in the ceiling. They only emerge from the safety of those cartridges when they’re inside the machines and it’s time for a key step in the process.

Atomic-Level Manufacturing

Chips consist of as many as 100 layers of materials. These are deposited, then partially removed, to form complex three-dimensional structures that connect all the tiny transistors. Some of these layers are just one atom thin. Machines made by Applied Materials Inc., Lam Research Corp. and Tokyo Electron Ltd. juggle a host of variables, such as temperature, pressure, and electrical and magnetic fields, to make this happen.

One of the most difficult parts of the process is lithography, which is handled by machines made by ASML Holding NV. The company’s gear uses light to burn patterns into materials deposited on the silicon. These patterns eventually become transistors. This is all happening at such a small scale, the current way to make it work is to use extreme ultraviolet light, which usually only occurs naturally in space. To recreate this in a controlled environment, ASML machines zap molten droplets of tin with a laser pulse. As the metal vaporizes, it emits the required EUV light. But even that is not enough. Mirrors are needed to focus the light into a thinner wavelength.

Burdensome Economics

Chip plants run 24 hours a day, seven days a week. They do that for one reason: cost. Building an entry-level factory that produces 50,000 wafers per month costs about $15 billion. Most of this is spent on specialized equipment—a market that exceeded $60 billion in sales for the first time in 2020.

Three companies—Intel, Samsung and TSMC—account for most of this investment. Their factories are more advanced and cost over $20 billion each. This year, TSMC will spend as much as $28 billion on new plants and equipment. Compare that to the U.S. government’s attempt to pass a bill supporting domestic chip production. This legislation would offer just $50 billion over five years.

Once you spend all that money building giant facilities, they become obsolete in five years or less. To avoid losing money, chipmakers must generate $3 billion in profit from each plant. But now only the biggest companies, in particular the top three that combined generated $188 billion in revenue last year, can afford to build multiple plants.

The more you do this, the better you get at it. Yield—the percentage of chips that aren’t discarded—is the key measure. Anything less than 90% is a problem. But chipmakers only exceed that level by learning expensive lessons over and over again, and building on that knowledge.

The brutal economics of the industry mean fewer companies can afford to keep up. Most of the roughly 1.4 billion smartphone processors shipped each year are made by TSMC. Intel has 80% of the market for computer processors. Samsung dominates in memory chips. For everyone else, including China, it’s not easy to break in.

Chip Shortage 2021: Semiconductors Are Hard to Make and That’s Part of the Problem

[paul]

Samsung Display today unveiled a range of new OLED panel options. This gives us a glimpse of the kind of devices that we can expect from the company in the future. The new options include significantly larger foldable panels in addition to an Under Display Camera panel.

It has long been rumored that Samsung is going to introduce a bi-folding Galaxy device. Samsung Display’s new S-Foldable OLED panel is going to make that happen. This panel can be part of an in-folding or out-folding device. When folded twice, the device can be used like a smartphone and when it’s unfolded, it reaches a maximum size of 7.2-inches.

Samsung’s slidable displays have long been the subject of much speculation as well. The company has a ton of patents on the technology as well. A prototype of the Slidable OLED display has now been revealed. This technology makes it possible to extend the screen horizontally without requiring any folds.

In what might be an indication that foldable Samsung tablets are coming, Samsung Display has shown off a 17-inch foldable panel today. It provides the screen real estate worthy of a tablet in the 4:3 aspect ratio when unfolded. A tablet with this display panel will certainly be a lot more versatile than anything on the market today.

Lastly, the company has unveiled its Under Panel Camera display. The solution it has showcased today is for notebooks, something that we’ve seen it tease previously as well. The front camera is mounted under the panel to allow for a truly edge-to-edge panel.

Samsung's new foldable and UDC panels reveal an exciting future - SamMobile

[paul]

Intel Core i5 11400F review de la DF:

So: the 11400F is proof that Intel's most competitive CPUs are now its cheaper offerings. The 11400F by and large provides better gaming performance than Ryzen 3000 and most Intel 10th-generation chips, while costing far less than the similarly performant Core i5 11600K and 11900K. AMD's Ryzen 5000 chips and the Core i9 10900K remain the best choices for mixed use - content creation plus gaming - but there are no doubt millions of people for which gaming is the primary focus. For these people, the 11400F represents unparalleled value.

Intel Core i5 11400F review: the best mainstream gaming CPU • Eurogamer.net

[paul]

Future Intel products (starting as early as its upcoming 12th Gen Alder Lake chips later this year) will no longer use the nanometer-based node nomenclature that both it and the rest of the chipmaking industry has used for years. Instead, Intel is debuting a new naming scheme that it says will provide “a more accurate view of process nodes across the industry” and how Intel’s products fit into that landscape.

How that works in practice is that those new third-generation 10nm chips will be referred to as “Intel 7,” instead of getting some 10nm-based name (like last year’s 10nm SuperFin chips).

Intel has a new architecture roadmap and a plan to retake its chipmaking crown in 2025 - The Verge

Intel has announced its first major customer for its new Intel Foundry Services business: Qualcomm. Best known for designing the Snapdragon chips that power most major Android phones, Qualcomm will start to have its chips manufactured by Intel in the coming years using Intel’s upcoming 20A process.

No timeframe has been announced for when the first Intel-made Qualcomm chips will arrive or which of Qualcomm’s products Intel will produce.

Additionally, Amazon’s AWS will be working with Intel Foundry Services, relying on Intel’s packaging solutions (although Intel won’t be directly making chips for Amazon).

Intel will make Qualcomm chips in new foundry deal - The Verge

[paul]

NEWS HIGHLIGHTS

- Intel launches the first products in the 12th Gen Intel® Core™ family, including Intel Core i9-12900K, the world’s best gaming processor; preorders start today with availability starting Nov. 4.
- New performance hybrid architecture delivers leaps in multi-threaded performance, enabling up to 2 times faster content creation compared to prior generation.
- Six desktop processors launched today lead the industry with the transition to DDR5 memory and PCIe 5.0 connectivity to enhance gaming and creator experiences.
- The 12th Gen Intel Core processor family is the first on Intel 7 process, delivering superior performance for every computing segment.

Today at Intel Innovation, Intel unveiled the 12th Gen Intel® Core™ processor family with the launch of six new unlocked desktop processors, including the world’s best gaming processor, the 12th Gen Intel Core i9-12900K. With a max turbo boost of up to 5.2 GHz and as many as 16 cores and 24 threads, the new desktop processors reach new heights of multi-threaded performance for enthusiast gamers and professional creators.

The full 12th Gen Intel Core family will include 60 processors, set to power more than 500 designs from a broad set of partners. As detailed during Intel Architecture Day 2021, the new performance hybrid architecture, the first built on Intel 7 process, delivers scalable performance from 9 to 125 watts to enable every PC segment from ultra-thin-and-light laptops to enthusiast desktops and out to the edge.

Intel Unveils 12th Gen Intel Core, Launches World’s Best Gaming...

[rodarkone]

Asta e hardware-ul meu nou

[IsNotMe]

Asta e hardware-ul meu nou

Wow ! it's alive ! ....and white? . Cat a costat ?

[GabiCutlac]

Vreau sa fac o configurație mai de buget pt a lucra în Unity, Adobe Illustrator/PS si Blender la nivel de hobby/amator (joculețe 2d/sidescrollers/puzzle/mobile). Nu vreau sa dau mai mult de 1700-2000 pe CPU +RAM+MB+SSD (sursa si carcasa am) . Cum pretul plăcilor video a explodat de cand cu cripto ma gandeam sa iau ceva cu GPU integrat. Întrebarea mea este daca un GPU integrat din prezent este mai bun decat un GTX 660 din 2012 (las si link) pe care il am acum prin casa? N-am mai urmărit evolutia componentelor de vreo 7-8 ani, poate e stupida întrebarea.
https://www.pcgarage.ro/placi-video/...-192-bit-hdmi/

[buzucan]

Pai de ce nu faci teste chiar tu?